Curix, part of the Demcon group, today announced that the SEISMIC research consortium, coordinated by Philips, together with the Erasmus MC as academic lead, has been awarded funding from the Innovative Health Initiative (IHI) to transform neurosurgery through the seamless integration of minimally invasive surgical techniques and advanced imaging technologies. The EUR 23.5 million public funding will be complemented by EUR 14.9 million in in-kind contributions and additional resources from industry partners, supporting a five-year research and innovation program that also includes eight clinical studies.

From 3 to 4 March 2026, we will exhibit at the Amsterdam Space Symposium in Amsterdam, the Netherlands. This event brings together experts from the global space ecosystem and adjacent sectors to address critical topics such as space infrastructure, security, and disruptive technologies.

The Blade Barrier was presented on July 2, 2025, as the first noise barrier constructed from discarded wind turbine blades. The 60-meter-long test setup is located along the A58 highway near Oirschot and will be monitored until the end of 2026 within InnovA58; de infraproeftuin van Rijkswaterstaat (the Dutch Ministry of Infrastructure and Water Management).

Technologieontwikkelaar en -producent Demcon breidt zijn technologische slagkracht verder uit met de toevoeging van Leap Development aan de Demcon group. De activiteiten worden voortgezet onder de naam Demcon electronics. De onderneming uit Deventer is specialist in RF technologie, draadloze communicatie, embedded systemen en geïntegreerde elektronica ontwikkeling. Met deze toevoeging heeft de Demcon group nu een gespecialiseerd bedrijf in huis dat zich volledig richt op elektronica-ontwikkelprojecten en beschikt over geavanceerde testfaciliteiten.

From 22 to 26 February 2026, we will attend SPIE Advanced Lithography + Patterning in San Jose, California. The exhibition focuses on the latest developments in optical lithography, EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing. Connect with us at booth #410 during SPIE Advanced Lithography + Patterning 2026.