The quantum industry is developing rapidly. New startups are emerging, and scale-ups are growing, particularly around Delft, the Netherlands. Internationally, there’s also growing interest in quantum computing, quantum sensing, and quantum communication. Given the complexity of the technology, the transition from prototype to product is a significant one. Demcon encounters this challenge with increasing frequency. The company has been working on high-tech systems for semiconductors, big science, and aerospace for decades, and uses this solid foundation to help quantum teams take the next step toward industrialization.

Technology developer and producer Demcon further expands its technological capabilities with the introduction of Leap Development into the Demcon group. The company will continue its activities under the banner of Demcon electronics. The Deventer-based organization specializes in RF technology, wireless communication, embedded systems and integrated electronics development. With this latest addition, the Demcon group now has a specialized company that is dedicated entirely to electronics development projects and has state-of-the-art testing facilities.

From 22 to 26 February 2026, we will attend SPIE Advanced Lithography + Patterning in San Jose, California. The exhibition focuses on the latest developments in optical lithography, EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing. Connect with us at booth #410 during SPIE Advanced Lithography + Patterning 2026.

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Demcon high-tech systems has been selected for Lot 4 in UKAEA’s Design & Build Framework, part of the Fusion Futures program. This selection follows our previous selections for Lot 2 and 3 within the new UKAEA Framework. This framework supports the development of future fusion technologies by engaging industry partners across design, engineering, prototyping and digital systems. This is now the third UKAEA framework in which Demcon participates, alongside the Engineering Design Services and Embedded Engineering Resource frameworks.

From 3 to 5 February 2026, we will exhibit at Binding Energy, the international conference on nuclear technologies in Aachen, Germany. This event brings together the fusion and fission communities to explore innovations in nuclear energy, including SMR deployment, tritium handling, and next-generation fusion power plant concepts. Later that month, from 25 to 27 February, we will also attend FusionX Global in Munich, Germany.